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| d a t a sh eet preliminary speci?cation supersedes data of 1999 sep 29 file under integrated circuits, ic01 2000 feb 01 integrated circuits tda3663 very low dropout voltage/quiescent current 3.3 v voltage regulator
2000 feb 01 2 philips semiconductors preliminary speci?cation very low dropout voltage/quiescent current 3.3 v voltage regulator tda3663 features fixed 3.3 v, 100 ma regulator supply voltage range up to 33 v (45 v) very low quiescent current of 15 m a (typical value) very low dropout voltage high ripple rejection very high stability: C electrolytic capacitors: equivalent series resistance (esr) < 30 w at i reg 25 ma C other capacitors: 100 nf at 200 m a i reg 100 ma. pin compatible family tda3662 to tda3666 protections: C reverse polarity safe (down to - 25 v without high reverse current) C negative transient of 50 v (r s =10 w , t < 100 ms) C able to withstand voltages up to 18 v at the output (supply line may be short-circuited) C esd protection on all pins C dc short-circuit safe to ground and v p of the regulator output C temperature protection (at t j > 150 c). general description the tda3663 is a fixed 3.3 v voltage regulator with a very low dropout voltage and quiescent current, which operates over a wide supply voltage range. the ic is available as: tda3663: v p 45 v, - 40 c t amb +125 c and sot4 package (automotive) TDA3663T: v p 33 v, - 40 c t amb +85 c and so8 package (non-automotive) tda3663at: v p 45 v, - 40 c t amb +125 c and so8 package (automotive). quick reference data ordering information symbol parameter conditions min. typ. max. unit supply v p input supply voltage regulator on tda3663 3 14.4 45 v TDA3663T 3 14.4 33 v tda3663at 3 14.4 45 v i q quiescent supply current v p = 14.4 v; i reg =0ma - 15 30 m a voltage regulator v reg output voltage 8 v v p 22 v; i reg = 0.5 ma 3.16 3.3 3.44 v 6v v p 45 v; i reg = 0.5 ma; 3.13 3.3 3.47 v 0.5 ma i reg 100 ma; v p = 14.4 v 3.13 3.3 3.47 v v reg(drop) dropout voltage i reg = 50 ma; t amb 85 c - 0.18 0.3 v type number package name description version tda3663 so4 plastic surface mounted package; collector pad for good heat transfer; 4 leads sot223 TDA3663T so8 plastic small outline package; 8 leads; body width 3.9 mm sot96-1 tda3663at so8 plastic small outline package; 8 leads; body width 3.9 mm sot96-1 2000 feb 01 3 philips semiconductors preliminary speci?cation very low dropout voltage/quiescent current 3.3 v voltage regulator tda3663 block diagram handbook, halfpage mgs584 regulator 2, 4 (2, 3, 6, 7) 3 (1) gnd 1 (8) reg v p band gap tda3663 thermal protection fig.1 block diagram. pins between brackets are for the so8 version. pinning note 1. for the so8 package all gnd pins are connected to the lead frame and can also be used to reduce the total thermal resistance r th(j-a) by soldering these pins to a ground plane. the ground plane on the top side of the pcb acts like a heat spreader. symbol pin description so4 so8 v p 1 8 supply voltage gnd 2 and 4 2, 3, 6 and 7 ground; note 1 reg 3 1 regulator output n.c. - 4 and 5 not connected 2000 feb 01 4 philips semiconductors preliminary speci?cation very low dropout voltage/quiescent current 3.3 v voltage regulator tda3663 functional description the tda3663 is a fixed 3.3 v regulator which can deliver output currents up to 100 ma. the regulator is available in so8 and so4 packages. the regulator is intended for portable, mains, telephone and automotive applications. to increase the lifetime of batteries, a specially built-in clamp circuit keeps the quiescent current of this regulator very low, also in dropout and full load conditions. the device remains operational down to very low supply voltages and below this voltage it switches off. a temperature protection circuit is included which switches off the regulator output at a junction temperature above 150 c. a new output circuit guarantees the stability of the regulator for a capacitor output circuit with an esr up to 38 w . this is very attractive as the esr of an electrolytic capacitor increases strongly at low temperatures (no expensive tantalum capacitor is required). handbook, halfpage 13 2 4 gnd mgl810 gnd v p reg fig.2 pin configuration of so4. handbook, halfpage 1 2 3 4 8 7 6 5 mgs585 tda3663 v p gnd gnd gnd n.c. n.c. gnd reg fig.3 pin configuration of so8. 2000 feb 01 5 philips semiconductors preliminary speci?cation very low dropout voltage/quiescent current 3.3 v voltage regulator tda3663 limiting values in accordance with the absolute maximum rating system (iec 134). thermal characteristics quality specification in accordance with snw-fq-611e . symbol parameter conditions min. max. unit v p supply voltage tda3663 - 45 v TDA3663T - 33 v tda3663at - 45 v v p(rp) reverse polarity supply voltage non-operating -- 25 v p tot total power dissipation so8 temperature of copper area is 25 c - 4.1 w so4 t amb =25 c - 5w t stg storage temperature non-operating - 55 +150 c t amb ambient temperature operating tda3663 - 40 +125 c TDA3663T - 40 +85 c tda3663at - 40 +125 c t j junction temperature operating - 40 +150 c symbol parameter conditions value unit r th(j-a) thermal resistance from junction to ambient so8 in free air; soldered in 125 k/w so4 in free air; soldered in 100 k/w r th(j-c) thermal resistance from junction to case so8 to centre pins; soldered 30 k/w so4 in free air 25 k/w 2000 feb 01 6 philips semiconductors preliminary speci?cation very low dropout voltage/quiescent current 3.3 v voltage regulator tda3663 characteristics v p = 14.4 v; t amb =25 c; measured with test circuit of fig.4; unless otherwise speci?ed. notes 1. the regulator output will follow v p if v p 2000 feb 01 7 philips semiconductors preliminary speci?cation very low dropout voltage/quiescent current 3.3 v voltage regulator tda3663 test and application information n dbook, halfpage mgs586 v p 13 2, 4 c2 tda3663 10 m f c1 (1) 1 m f v reg = 3.3 v fig.4 test circuit (so4). (1) c1 is optional (to minimize supply noise only). handbook, halfpage mda961 esr ( w ) c2 ( m f) 10 2 10 1 10 - 1 10 - 1 11010 2 stable region (2) (1) fig.5 graph for selecting the value of the output capacitor. (1) maximum esr at 200 m a i reg 100 ma. (2) minimum esr only when i reg 200 m a. noise the output noise is determined by the value of the output capacitor the noise figure is measured at a bandwidth of 10 hz to 100 khz (see table 1). table 1 noise ?gures stability the regulator is stabilized with an external capacitor connected to the output. the value of this capacitor can be selected using the diagrams shown in figs 5 and 6. the following four examples show the effects of the stabilization circuit using different values for the output capacitor. output current i reg (ma) noise figure ( m v) c2 = 10 m fc2=47 m f c2 = 100 m f 0.5 550 320 300 50 650 400 400 handbook, halfpage mda962 esr ( w ) i reg (ma) 10 3 10 2 10 22 1 10 - 1 110 10 3 10 2 stable region fig.6 esr as a function of i reg for selecting the value of the output capacitor. 2000 feb 01 8 philips semiconductors preliminary speci?cation very low dropout voltage/quiescent current 3.3 v voltage regulator tda3663 e xample 1 the regulator is stabilized with an electrolytic capacitor of 68 m f (esr = 0.5 w ). at t amb = - 40 c, the capacitor value is decreased to 22 m f and the esr is increased to 3.5 w . the regulator will remain stable at a temperature of t amb = - 40 c. e xample 2 the regulator is stabilized with an electrolytic capacitor of 10 m f (esr = 3.3 w ). at t amb = - 40 c, the capacitor value is decreased to 3 m f and the esr is increased to 20 w . the regulator will remain stable at a temperature of t amb = - 40 c. e xample 3 the regulator is stabilized with a 100 nf mkt capacitor connected to the output. when the output current is over 200 m a full stability is guaranteed. because the thermal influence on the capacitor value is almost zero, the regulator will remain stable at a temperature of t amb = - 40 c. e xample 4 the regulator is stabilized with a 100 nf capacitor in parallel with an electrolytic capacitor of 10 m f connected to the output. the regulator is now stable under all conditions and independent of: the esr of the electrolytic capacitor the value of the electrolytic capacitor the output current. application circuits the maximum output current of the regulator equals: when t amb =21 c and v p = 14 v the maximum output current equals 116 ma. the total thermal resistance of the tda3663 can be decreased from 120 k/w to 50 k/w for the so8 version. for the so4 version it can be decreased from 100 to 40 k/w when gnd pins 2 and 4 of the package are soldered to the printed-circuit board. a pplication circuit with backup function sometimes a backup function is needed to supply, for example, a microcontroller for a short period of time when the supply voltage spikes to 0 v (or even - 1 v). this function can easily be built with the tda3663 by using an output capacitor with a large value. when the supply voltage is 0 v (or - 1 v), only a small current will flow into pin reg from this output capacitor (a few m a). the application circuit is given in fig.7. i reg max () 150 t amb C r th(j-a) v p v reg C () ------------------------------------------------------ - = 150 t amb C 100 v p 3.3 C () ------------------------------------------ = (ma) an dbook, halfpage mgs587 v p 13 2, 4 c2 (2) tda3663 c1 (1) 1 m f v reg = 3.3 v fig.7 application circuit with backup function (so4 version). (1) c1 is optional (to minimize supply noise only). (2) c2 4700 m f. 2000 feb 01 9 philips semiconductors preliminary speci?cation very low dropout voltage/quiescent current 3.3 v voltage regulator tda3663 additional application information this section gives typical curves for various parameters measured on the tda3663at. standard test conditions are: v p = 14.4 v; t amb =25 c. handbook, halfpage 010 v p (v) i q ( m a) 20 30 25 0 20 15 10 5 mda947 fig.8 quiescent current as a function of the supply voltage. i reg = 0 ma. handbook, halfpage 010 50 4 3 1 0 2 20 30 v p (v) i q (ma) 40 mda949 fig.9 quiescent current increase as a function of high supply voltage. handbook, halfpage - 40 0 (1) (2) 160 2 1.5 0.5 0 1 40 80 t j ( c) i q (ma) 120 mda951 fig.10 quiescent current as a function of the junction temperature. (1) i q at 50 ma load. (2) i q at 10 ma load. handbook, halfpage 5 0.36 0.40 0.44 0.48 10 15 v p (v) i q (ma) 25 20 mda948 fig.11 quiescent current as a function of the supply voltage. i reg = 10 ma. 2000 feb 01 10 philips semiconductors preliminary speci?cation very low dropout voltage/quiescent current 3.3 v voltage regulator tda3663 handbook, halfpage 5 1.4 1.6 1.8 2 10 15 v p (v) i q (ma) 25 20 mda950 fig.12 quiescent current as a function of the supply voltage. i reg = 50 ma. handbook, halfpage 0 20 100 4 3 1 0 2 40 60 i reg (ma) i q (ma) 80 mda952 fig.13 quiescent current as a function of the output current. handbook, halfpage - 50 200 3.40 3.25 3.30 3.35 050 t j ( c) v reg (v) 100 150 mgs694 fig.14 output voltage as a function of the junction temperature. i reg = 0 ma. handbook, halfpage - 50 200 4 0 1 3 2 050 t j ( c) v reg (v) 100 150 mgs695 fig.15 output voltage thermal protection as a function of the junction temperature. i reg = 0 ma. 2000 feb 01 11 philips semiconductors preliminary speci?cation very low dropout voltage/quiescent current 3.3 v voltage regulator tda3663 handbook, halfpage 040 i reg (ma) v reg(drop) (mv) 80 120 500 400 200 100 300 mda957 fig.16 dropout voltage as a function of the output current. handbook, halfpage 0 4 3 2 1 0 100 v reg (v) i reg (ma) 200 300 mgs696 fig.17 fold back protection mode. v p = 8 v and pulsed load. handbook, halfpage - 70 - 60 - 50 - 40 - 30 mda956 10 svrr (db) f (hz) 10 2 10 3 10 4 10 5 (1) (1) (2) (2) (3) (3) i reg = 10 ma; c2 = 10 m f. (1) svrr at r l = 100 w . (2) svrr at r l = 500 w . (3) svrr at r l =10k w . fig.18 svrr as a function of the ripple frequency. 2000 feb 01 12 philips semiconductors preliminary speci?cation very low dropout voltage/quiescent current 3.3 v voltage regulator tda3663 package outlines unit a 1 b p cd e e 1 h e l p qy w v references outline version european projection issue date iec jedec eiaj mm 0.10 0.01 1.8 1.5 0.80 0.60 b 1 3.1 2.9 0.32 0.22 6.7 6.3 3.7 3.3 2.3 e 4.6 7.3 6.7 1.1 0.7 0.95 0.85 0.1 0.1 0.2 dimensions (mm are the original dimensions) sot223 sc-73 97-02-28 99-09-13 w m b p d b 1 e 1 e a a 1 l p q detail x h e e v m a a b b c y 0 2 4 mm scale a x 13 2 4 plastic surface mounted package; collector pad for good heat transfer; 4 leads sot223 2000 feb 01 13 philips semiconductors preliminary speci?cation very low dropout voltage/quiescent current 3.3 v voltage regulator tda3663 unit a max. a 1 a 2 a 3 b p cd (1) e (2) (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec eiaj mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.1 0.25 dimensions (inch dimensions are derived from the original mm dimensions) notes 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. plastic or metal protrusions of 0.25 mm maximum per side are not included. 1.0 0.4 sot96-1 x w m q a a 1 a 2 b p d h e l p q detail x e z e c l v m a (a ) 3 a 4 5 pin 1 index 1 8 y 076e03 ms-012 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.20 0.19 0.16 0.15 0.050 0.244 0.228 0.028 0.024 0.028 0.012 0.01 0.01 0.041 0.004 0.039 0.016 0 2.5 5 mm scale so8: plastic small outline package; 8 leads; body width 3.9 mm sot96-1 97-05-22 99-12-27 2000 feb 01 14 philips semiconductors preliminary speci?cation very low dropout voltage/quiescent current 3.3 v voltage regulator tda3663 soldering introduction to soldering surface mount packages this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our data handbook ic26; integrated circuit packages (document order number 9398 652 90011). there is no soldering method that is ideal for all surface mount ic packages. wave soldering is not always suitable for surface mount ics, or for printed-circuit boards with high population densities. in these situations reflow soldering is often used. re?ow soldering reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. typical reflow peak temperatures range from 215 to 250 c. the top-surface temperature of the packages should preferable be kept below 230 c. wave soldering conventional single wave soldering is not recommended for surface mount devices (smds) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. to overcome these problems the double-wave soldering method was specifically developed. if wave soldering is used the following conditions must be observed for optimal results: use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. for packages with leads on two sides and a pitch (e): C larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; C smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves at the downstream end. for packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves downstream and at the side corners. during placement and before soldering, the package must be fixed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. typical dwell time is 4 seconds at 250 c. a mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. manual soldering fix the component by first soldering two diagonally-opposite end leads. use a low voltage (24 v or less) soldering iron applied to the flat part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 c. 2000 feb 01 15 philips semiconductors preliminary speci?cation very low dropout voltage/quiescent current 3.3 v voltage regulator tda3663 suitability of surface mount ic packages for wave and re?ow soldering methods notes 1. all surface mount (smd) packages are moisture sensitive. depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). for details, refer to the drypack information in the data handbook ic26; integrated circuit packages; section: packing methods . 2. these packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. if wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. the package footprint must incorporate solder thieves downstream and at the side corners. 4. wave soldering is only suitable for lqfp, tqfp and qfp packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. wave soldering is only suitable for ssop and tssop packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. definitions life support applications these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips for any damages resulting from such improper use or sale. package soldering method wave reflow (1) bga, sqfp not suitable suitable hlqfp, hsqfp, hsop, htssop, sms not suitable (2) suitable plcc (3) , so, soj suitable suitable lqfp, qfp, tqfp not recommended (3)(4) suitable ssop, tssop, vso not recommended (5) suitable data sheet status objective speci?cation this data sheet contains target or goal speci?cations for product development. preliminary speci?cation this data sheet contains preliminary data; supplementary data may be published later. product speci?cation this data sheet contains ?nal product speci?cations. limiting values limiting values given are in accordance with the absolute maximum rating system (iec 134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information where application information is given, it is advisory and does not form part of the speci?cation. ? philips electronics n.v. sca all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not con vey nor imply any license under patent- or other industrial or intellectual property rights. internet: http://www.semiconductors.philips.com 2000 69 philips semiconductors C a worldwide company for all other countries apply to: philips semiconductors, international marketing & sales communications, building be-p, p.o. box 218, 5600 md eindhoven, the netherlands, fax. +31 40 27 24825 argentina: see south america australia: 3 figtree drive, homebush, nsw 2140, tel. +61 2 9704 8141, fax. +61 2 9704 8139 austria: computerstr. 6, a-1101 wien, p.o. box 213, tel. +43 1 60 101 1248, fax. +43 1 60 101 1210 belarus: hotel minsk business center, bld. 3, r. 1211, volodarski str. 6, 220050 minsk, tel. +375 172 20 0733, fax. +375 172 20 0773 belgium: see the netherlands brazil: see south america bulgaria: philips bulgaria ltd., energoproject, 15th floor, 51 james bourchier blvd., 1407 sofia, tel. +359 2 68 9211, fax. +359 2 68 9102 canada: philips semiconductors/components, tel. +1 800 234 7381, fax. +1 800 943 0087 china/hong kong: 501 hong kong industrial technology centre, 72 tat chee avenue, kowloon tong, hong kong, tel. +852 2319 7888, fax. +852 2319 7700 colombia: see south america czech republic: see austria denmark: sydhavnsgade 23, 1780 copenhagen v, tel. +45 33 29 3333, fax. +45 33 29 3905 finland: sinikalliontie 3, fin-02630 espoo, tel. +358 9 615 800, fax. +358 9 6158 0920 france: 51 rue carnot, bp317, 92156 suresnes cedex, tel. +33 1 4099 6161, fax. +33 1 4099 6427 germany: hammerbrookstra?e 69, d-20097 hamburg, tel. +49 40 2353 60, fax. +49 40 2353 6300 hungary: see austria india: philips india ltd, band box building, 2nd floor, 254-d, dr. annie besant road, worli, mumbai 400 025, tel. +91 22 493 8541, fax. +91 22 493 0966 indonesia: pt philips development corporation, semiconductors division, gedung philips, jl. buncit raya kav.99-100, jakarta 12510, tel. +62 21 794 0040 ext. 2501, fax. +62 21 794 0080 ireland: newstead, clonskeagh, dublin 14, tel. +353 1 7640 000, fax. +353 1 7640 200 israel: rapac electronics, 7 kehilat saloniki st, po box 18053, tel aviv 61180, tel. +972 3 645 0444, fax. +972 3 649 1007 italy: philips semiconductors, via casati, 23 - 20052 monza (mi), tel. +39 039 203 6838, fax +39 039 203 6800 japan: philips bldg 13-37, kohnan 2-chome, minato-ku, tokyo 108-8507, tel. +81 3 3740 5130, fax. +81 3 3740 5057 korea: philips house, 260-199 itaewon-dong, yongsan-ku, seoul, tel. +82 2 709 1412, fax. +82 2 709 1415 malaysia: no. 76 jalan universiti, 46200 petaling jaya, selangor, tel. +60 3 750 5214, fax. +60 3 757 4880 mexico: 5900 gateway east, suite 200, el paso, texas 79905, tel. +9-5 800 234 7381, fax +9-5 800 943 0087 middle east: see italy netherlands: postbus 90050, 5600 pb eindhoven, bldg. vb, tel. +31 40 27 82785, fax. +31 40 27 88399 new zealand: 2 wagener place, c.p.o. box 1041, auckland, tel. +64 9 849 4160, fax. +64 9 849 7811 norway: box 1, manglerud 0612, oslo, tel. +47 22 74 8000, fax. +47 22 74 8341 pakistan: see singapore philippines: philips semiconductors philippines inc., 106 valero st. salcedo village, p.o. box 2108 mcc, makati, metro manila, tel. +63 2 816 6380, fax. +63 2 817 3474 poland : al.jerozolimskie 195 b, 02-222 warsaw, tel. +48 22 5710 000, fax. +48 22 5710 001 portugal: see spain romania: see italy russia: philips russia, ul. usatcheva 35a, 119048 moscow, tel. +7 095 755 6918, fax. +7 095 755 6919 singapore: lorong 1, toa payoh, singapore 319762, tel. +65 350 2538, fax. +65 251 6500 slovakia: see austria slovenia: see italy south africa: s.a. philips pty ltd., 195-215 main road martindale, 2092 johannesburg, p.o. box 58088 newville 2114, tel. +27 11 471 5401, fax. +27 11 471 5398 south america: al. vicente pinzon, 173, 6th floor, 04547-130 s?o paulo, sp, brazil, tel. +55 11 821 2333, fax. +55 11 821 2382 spain: balmes 22, 08007 barcelona, tel. +34 93 301 6312, fax. +34 93 301 4107 sweden: kottbygatan 7, akalla, s-16485 stockholm, tel. +46 8 5985 2000, fax. +46 8 5985 2745 switzerland: allmendstrasse 140, ch-8027 zrich, tel. +41 1 488 2741 fax. +41 1 488 3263 taiwan: philips semiconductors, 6f, no. 96, chien kuo n. rd., sec. 1, taipei, taiwan tel. +886 2 2134 2886, fax. +886 2 2134 2874 thailand: philips electronics (thailand) ltd., 209/2 sanpavuth-bangna road prakanong, bangkok 10260, tel. +66 2 745 4090, fax. +66 2 398 0793 turkey: yukari dudullu, org. san. blg., 2.cad. nr. 28 81260 umraniye, istanbul, tel. +90 216 522 1500, fax. +90 216 522 1813 ukraine : philips ukraine, 4 patrice lumumba str., building b, floor 7, 252042 kiev, tel. +380 44 264 2776, fax. +380 44 268 0461 united kingdom: philips semiconductors ltd., 276 bath road, hayes, middlesex ub3 5bx, tel. +44 208 730 5000, fax. +44 208 754 8421 united states: 811 east arques avenue, sunnyvale, ca 94088-3409, tel. +1 800 234 7381, fax. +1 800 943 0087 uruguay: see south america vietnam: see singapore yugoslavia: philips, trg n. pasica 5/v, 11000 beograd, tel. +381 11 3341 299, fax.+381 11 3342 553 printed in the netherlands 753503/02/pp 16 date of release: 2000 feb 01 document order number: 9397 750 06798 |
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